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The WACCO Edge Grip Aligner is a high
reliability aligner with
high-precision mechanics.
No using vacuum-operated chuck , the EGA300C is free
of backside
contamination of a wafer. |
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◈ Modular wafer pre-aligner with NO external dedicated
controller
◈ Compact Footprint
◈ Non backside contamination
◈ Class 1 Cleanroom compatible
◈ Highly Reliable and Repeatable Positioning
◈ Fastest Cycle Time ( High throughput )
◈ Easy to Use and Install |
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| Item |
Specifications |
| Dimension |
360(W)x258(D)x322(H) |
| Wafer Size |
300mm(12") |
| Alignment Accuracy |
Centering : ± 0.1mm
Angle : ± 0.1˚ |
| Alignment time |
Within 3 secs/wafer |
| Utility Requirement |
Input power : 24Vdc/6A
Air pressyre : ≥ 4 Bar |
| Interface |
RS-232C and RS-485 |
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