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Inspection °øÁ¤¿¡¼ Accept ¹× Reject À¯¹«¸¦
Host·ÎºÎÅÍ ¹Þ¾Æ ÃÖÁ¾ÀûÀ¸·Î
Wafer¸¦ IDº°·Î ºÐ·ùÇÏ¿© FOUP ¹× FOSB·Î ÀÌÀçÇÏ´Â ÀåÄ¡ÀÌ´Ù. |
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¢Â IDÀÇ Marking À§Ä¡¿¡(Front Side, Back Side, Angle)
±¸¾Ö ¹ÞÁö ¾Ê°í ÀÐÀ» ¼ö ÀÖ°Ô Çϱâ À§ÇØ OCR ModuleÀ» 3ÃàÀ¸·Î ¡¡
À̵¿µÇµµ·Ï FlexibleÇÏ°Ô
¼³°è.
¢Â ºü¸£°í Á¤È®ÇÑ OCR ±â´ÉÀ» ±â¹ÝÀ¸·Î Mixing lot °ËÃâ, Laser Marking½Ã character Missing ¿©ºÎ °ËÃâ,
CharacterÀÇ ½ÉÇÑ ¡¡
ÈѼտ¡ ÀÇÇÑ OCR ½ÇÆÐ µîÀ» °ËÃâ °¡´É.
¢Â »ç¿ëÀÚ°¡ ½±°Ô »ç¿ëÇÒ ¼ö ÀÖ´Â GUI·Î ±¸¼ºµÇ¸ç, °¢Á¾ Error Logging ¹× Self Diagnosis¿¡ ÀÇÇÑ
¢Â Error °ËÃâÀ» ÇÒ ¼ö ÀÖÀ¸¸ç Error ¹ß»ý ½Ã Operator¿¡°Ô Case º°·Î ÀûÀýÇÑ ´ëÀÀ ¹æ¹ýÀ» Screen »ó¿¡ Á¦½ÃÇÔÀ¸·Î½á
¡¡½Å¼ÓÇÏ°Ô ÀÛ¾÷À¸·ÎÀÇ º¹±Í°¡ °¡´É.
¢Â °¢ ºÎºÐ ÇÙ½É ModuleÀ» ÀÌ·Â °ü¸®ÇÔÀ¸·Î½á ¹®Á¦ ¹ß»ý ½Ã ÃßÀûÀÌ °¡´É.
¢Â Compact ÇÑ Moving Pass¸¦ ±¸¼ºÇÔÀ¸·Î½á ThroughputÀÌ ±Ø´ëÈ µÇµµ·Ï ¼³°è
¢Â SEMI Standard ¹× »ç¿ëÀÚÀÇ ¾ÈÁ¤¼ºÀ» °í·ÁÇÑ Compact Load / Unload Port äÅÃ.
¢Â Mini-environment¸¦ ¼³Ä¡ÇÔÀ¸·Î½á Class 10ÀÇ ¿Ïº®ÇÑ Particle control °¡´É.
¢Â ESD(Electro static discharge)·ÎºÎÅÍÀÇ ¾ÈÀü¼ºÀ» °í·ÁÇÑ ¼³°è.
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Description |
Specification |
Dimension (W x D x H) |
¡¡ 3338 x 2162 x 2142.5 mm |
Weight |
¡¡ About 1600 Kg |
Utility |
Electric
Power |
¡¡ 3P, 3¥Õ, 220V/60Hz, 10A |
UPS |
¡¡ 1P, 220V/60Hz, 300W |
Vacuum |
¡¡ £¾500mmHg |
Air Pressure |
¡¡ £¾ 5 Bar |
Performance |
Handling Wafer |
¡¡ 12¡± |
Throughput |
¡¡ Target FOSB(OK °æ¿ì) : £¾130 Wafers/Hr
¡¡ Target FOUP(NG °æ¿ì) : £¾80 Wafers/Hr |
Lord Port |
¡¡ FOUP Opener : 1 Ports |
Unload Port |
¡¡ FOSB Opener : 2 Ports
¡¡ FOUP Opener : 5 Ports |
Transfer Robot |
¡¡ Edge Grip & Single Arm Type
4Ãà Robot : 2´ë |
OCR |
¡¡ Cognex»ç In-Sight 1701 : 2´ë
(Front / Back Side) |
BCR |
¡¡ For FOUP Opener : Keyence BL-601HASO(7099)
¡¡ For FOSB Opener : Handy Type |
Pre Aligner |
¡¡ Edge Grip Type : 1´ë |
Environment |
¡¡ FFU / lonizer
¡¡ Cleanliness : Class 10 @ 0.1§ |
Host Communication |
¡¡ TCP/IP Port and SECS/GEM for
Host Grading |
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