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The WACCO Wafer Edge Exposure is a system to exposure
wafer edge with UV light source in a certain recipe.
The EEW300 Increase process efficiency by removing resist around a wafer. |
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◈ Compact Footprint
◈ High Reliable and Repeatable Positioning
◈ Fast Wafer Centering and Flat/Notch Zone Aligning (Non-contact type)
◈ The EEW300 with Buffer Part can improve throughput in your system as 30 ~ 40%
◈ Flexible Loading Methods One is Pin-Load Mode, The Other is Chuck-Load Mode.
◈ Class 1 Clean Room Compatible
◈ Fastest Cycle Time(High Throughput)
◈ Easy to Use and Install |
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| Item |
Specifications |
| Dimension |
400(W)x500(D)x560(H) |
| Wafer Size |
300mm Notch Type |
| Exposure Mode |
Round, Linear |
| Wavelength |
243, 365 mm |
| Exposure Width |
0.5 ~ 10 mm |
| Resist Slope |
≤ 10μm |
| Throughput |
Round : 80 Wfs/Hr
Round + Linear : 60 Wfs/Hr |
| Exposure Accuracy |
Centering : ± 0.05mm
Angle : ± 0.05˚ |
| Utility |
Power : 220VAC, 1φ , 50/60Hz
Vacuum Pressure : ≥ 600 mmHg
Air Pressure : ≥ 4 Bar |
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