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¡¡ The WACCO Wafer Edge Exposure is a system to exposure
wafer edge with UV light source in a ¡¡ ¡¡ certain recipe.
¡¡ The EEW300 Increase process efficiency by removing resist around a wafer. |
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¢Â Compact Footprint
¢Â High Reliable and Repeatable Positioning
¢Â Fast Wafer Centering and Flat/Notch Zone Aligning (Non-contact type)
¢Â The EEW300 with Buffer Part can improve throughput in your system as 30 ~ 40%
¢Â Flexible Loading Methods One is Pin-Load Mode, The Other is Chuck-Load Mode.
¢Â Class 1 Clean Room Compatible
¢Â Fastest Cycle Time(High Throughput)
¢Â Easy to Use and Install |
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Item |
Specifications |
Dimension |
¡¡ 400(W)x500(D)x560(H) |
Wafer Size |
¡¡ 300mm Notch Type |
Exposure Mode |
¡¡ Round, Linear |
Wavelength |
¡¡ 243, 365 mm |
Exposure Width |
¡¡ 0.5 ~ 10 mm |
Resist Slope |
¡¡ ¡Â 10¥ìm |
Throughput |
¡¡ Round : 80 Wfs/Hr
¡¡ Round + Linear : 60 Wfs/Hr |
Exposure Accuracy |
¡¡ Centering : ¡¾ 0.05mm
¡¡ Angle : ¡¾ 0.05¢ª |
Utility |
¡¡ Power : 220VAC, 1¥õ , 50/60Hz
¡¡ Vacuum Pressure : ¡Ã 600 mmHg
¡¡ Air Pressure : ¡Ã 4 Bar |
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