The WACCO Wafer Edge Exposure is a system to exposure wafer edge with UV light source in a     certain recipe.
  The EEW300 Increase process efficiency by removing resist around a wafer.
 
◈ Compact Footprint
◈ High Reliable and Repeatable Positioning
◈ Fast Wafer Centering and Flat/Notch Zone Aligning (Non-contact type)
◈ The EEW300 with Buffer Part can improve throughput in your system as 30 ~ 40%
◈ Flexible Loading Methods One is Pin-Load Mode, The Other is Chuck-Load Mode.
◈ Class 1 Clean Room Compatible
◈ Fastest Cycle Time(High Throughput)
◈ Easy to Use and Install
 
Item Specifications
Dimension   400(W)x500(D)x560(H)
Wafer Size   300mm Notch Type
Exposure Mode   Round, Linear
Wavelength   243, 365 mm
Exposure Width   0.5 ~ 10 mm
Resist Slope   ≤ 10μm
Throughput   Round : 80 Wfs/Hr
  Round + Linear : 60 Wfs/Hr
Exposure Accuracy   Centering : ± 0.05mm
  Angle : ± 0.05˚
Utility   Power : 220VAC, 1φ , 50/60Hz
  Vacuum Pressure : ≥ 600 mmHg
  Air Pressure : ≥ 4 Bar