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The WACCO Standalone Wafer Edge Exposure is a system
to exposure wafer edge with UV light source in a
certain
recipe.
The SEEW 200 Increase process efficiency by removing photoresist
around a wafer. |
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◈ Compact Footprint
◈ High Reliable and Repeatable Positioning
◈ High Accurate Removal of Photoresist from Wafer Periphery
◈ Fast Wafer Centering and Flat/Notch Zone Aligning (Non- contact
type)
◈ High Reliability and Repeatability Wafer Handling Dual Armed Robot
◈ Perfect Wafer Mapping
◈ 2Uni-Cassette Stage
◈ Class 1 Clean Room Compatible
◈ Fastest Cycle Time(High Throughput)
◈ Easy to Use and Install |
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| Item |
Specifications |
| Dimension |
750(W)x1200(D)x1300(H) |
| Wafer Size |
200mm |
| Exposure Mode |
Round, Linear |
| Radiation Wavelength |
248, 365 mm |
| Exposure Width |
0.5 ~ 10 mm |
| Exposure Width Accuracy |
±0.05mm |
| Resist Slope |
≤ 10μm |
| Irradiance |
Max. 1500mW/㎠ |
| Lamp's Guaranteed Life |
2000 hours |
| Throughput |
Round : 100 Wfs/Hr
Round + Linear : 80 Wfs/Hr |
| Aligning Accuracy |
Centering : ± 0.05mm
Angle : ± 0.05˚ |
| Utility Requirement |
Power : 220VAC, 1φ , 30A, 50/60Hz
Vacuum Pressure : ≥ 600 mmHg(80kPa)
Exhaust : 5㎥/min(Main), 1㎥/min(Lamp Housing) |
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